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Thermal Management Ain’t That Hard
So a lot of folks trying to manage heat in their high powered, tightly packed electronic devices get overwhelmed by complexity, since their devices can often look like this: But even if your device is...
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How To Use Shell Meshing For Thermal Studies
I could make this blog post real short: For convection, double “h”; for radiation, double “f” (or avoid the surface-to-ambient option); and for conduction layers, use Solid meshing. Instead, how about...
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Estimating Printed-Circuit-Board Thermal Properties
Let’s say you have SOLIDWORKS Flow Simulation, with the Electronics Systems Cooling (ESC) database extension. And let’s assume you are are analyzing an assembly that contains a printed circuit board,...
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What Makes Simulation Professional?
The Simulation Professional package unlocks six additional Study types – other kinds of physics – beyond the common linear-elastic stress/strain response of a Static analysis found in Simulation...
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Tips for Managing Time-Dependent Thermal Analysis
If you want to do a time-dependent FEA analysis, you generally need the nonlinear solvers that are available in SOLIDWORKS Simulation Premium. The notable exception to this is the thermal study. This...
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